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专利名称：Wiring Assembly And Method of Forming A
Channel In A Wiring Assembly For ReceivingConductor
发明人：Rainer Meinke,Gerald Stelzer申请号：US12061813申请日：20080403
公开号：US20090251270A1公开日：20091008
专利附图：
摘要：A conductor assembly and method for constructing an assembly of the typewhich, when conducting current, generates a magnetic field or which, in the presence of a
changing magnetic field, induces a voltage. In one embodiment the method provides afirst layer that is tubular in shape with an outer surface along which a conductor may bepositioned. A channel defining a first conductor path is formed in the first layer outersurface to create a pattern extending along the first layer. A first segment of conductoris placed in the first channel and defines a shape about an aperture region. After placingthe first segment of conductor in the first channel, at least part of the first layer outersurface and at least part of the first segment of conductor are coated with a secondlayer. A second channel is formed along an outer surface of the second layer to define asecond conductor path extending about the aperture region for placement of a secondsegment of conductor.
申请人：Rainer Meinke,Gerald Stelzer
地址：Melbourne FL US,Palm Bay FL US
国籍：US,US
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