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Guard ring structure and method for forming the sa

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专利内容由知识产权出版社提供

专利名称:Guard ring structure and method for

forming the same

发明人:Chiyuan Lu,Chien-Chih Lin,Cheng-Chou

Hung,Yu-Hua Huang

申请号:US15186937申请日:20160620公开号:US09947627B2公开日:20180417

专利附图:

摘要:A guard ring structure having a semiconductor substrate with a circuit regionencircled by a first ring and a second ring. At least one of the first and second ring

includes: a plurality of separated doping regions formed in various top portions of thesemiconductor substrate, providing P-N junction or N-P junction on bottom of theplurality of separated doping regions; and an interconnect element formed over thesemiconductor substrate, covering at least portion of the plurality of separated dopingregions.

申请人:MediaTek Singapore Pte. Ltd.

地址:Singapore SG

国籍:SG

代理机构:McClure, Qualey & Rodack, LLP

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