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Low temperature ALD SiO2

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专利名称:Low temperature ALD SiO2发明人:Mahajani, Maitreyee,Huang, Yi-Chiau,McDougall, Brendan

申请号:EP07021810.2申请日:20071109公开号:EP1925691A1公开日:20080528

专利附图:

摘要:The present invention comprises a silicon dioxide atomic layer depositionmethod. By providing pyridine as a catalyst, water may be utilized as the oxidizationsource while depositing at a low temperature. Prior to exposing the substrate to the

water, the substrate may be exposed to a pyridine soak process. Additionally, the watermay be co-flowed to the chamber with the pyridine through separate conduits to reduceinteraction prior to entering the chamber. Alternatively, the pyridine may be co-flowedwith a silicon precursor that does not react with pyridine.

申请人:Applied Materials, Inc.

地址:3050 Bowers Avenue Santa Clara, CA 95054 US

国籍:US

代理机构:Zimmermann, Gerd Heinrich

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