专利内容由知识产权出版社提供
专利名称：Multi-chip semiconductor package structure发明人：Kuang-Ho Liao,Feng Lin,Yun-sheng Chen申请号：US09788703申请日：20010220公开号：US058617B1公开日：20021001
专利附图：
摘要：A multi-chip semiconductor package structure. The structure includes two chipsand two lead frames. The leads on one of the lead frames have inner leads at one endand joint sections at the other end. The joint sections are connected with another leadframe. Both lead frames use a common set of external leads. The two chips and two lead
frames are joined together forming a lead-on-chip structure with the two chips facingeach other back-to-back. The assembly except the external leads is enclosed bypackaging material.
申请人：VANGUARD INTERNATIONAL SEMICONDUCTOR CORP.
代理机构：J.C. Patents
更多信息请下载全文后查看
