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Methods for fabricating integrated circuits using

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专利名称:Methods for fabricating integrated circuits

using directed self-assembly chemoepitaxy

发明人:Ji Xu,Gerard Schmid,Richard A. Farrell申请号:US14692359申请日:20150421公开号:US09613807B2公开日:20170404

专利附图:

摘要:Methods for directed self-assembly (DSA) using chemoepitaxy in the design andfabrication of integrated circuits are disclosed herein. An exemplary method includesforming an A or B-block attracting layer over a base semiconductor layer, forming a

trench in the A or B-block attracting layer to expose a portion of the base semiconductorlayer, and forming a neutral brush or mat or SAMs layer coating within the trench andover the base semiconductor layer. The method further includes forming a block

copolymer layer over the neutral layer coating and over the A or B-block attracting layerand annealing the block copolymer layer to form a plurality of vertically-oriented,cylindrical structures within the block copolymer layer.

申请人:GLOBALFOUNDRIES, Inc.

地址:Grand Cayman KY

国籍:KY

代理机构:Lorenz & Kopf, LLP

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