专利内容由知识产权出版社提供
专利名称：High frequency package发明人：海野 友幸申请号：JP2019040918申请日：20190306公开号：JP2020145318A公开日：20200910
专利附图：
摘要：Problem to be solved: to obtain a high frequency package capable ofpreventing the shielding property of the bump bumps due to underfill material. Thehigh-frequency package 100 comprises a first wiring substrate 1, a high-frequency device3, an underfill material 6, a shield bump 5 and a second wiring substrate 2.The high-frequency device 3 is electrically connected to a first wiring substrate 1 via a bump bump4.The underfill material 6 is filled between the high-frequency device 3 and the firstwiring substrate 1.The bump bump 5 is disposed around the high-frequency device 3 onthe first wiring substrate 1.The second wiring substrate 2 is electrically connected to thefirst wiring substrate 1 via a bump bump 5 for shielding.A resist opening 10, which is anopening of the resist, is formed in the first wiring substrate 1 between the bump bump 5
and the underfill material 6.Diagram
申请人：三菱電機株式会社
地址：東京都千代田区丸の内二丁目７番３号
国籍：JP
代理人：高村 順
更多信息请下载全文后查看
