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专利名称：High frequency package
发明人：Hideki Asao,Hiroshi Osakada,Hideyuki
Oohashi,Kyouko Shinozaki,Kenji Tatano
申请号：US10824503申请日：20040415
公开号：US20050104792A1公开日：20050519
专利附图：
摘要：High frequency packages have a plurality of apertures (notches) as antennas,and each of these apertures possesses a specific resonance frequency that may existwithin the frequency bandwidth used in the high frequency packages in a high frequency
band. Thus, the resonance frequency produced within the package is shifted outside thefrequency bandwidth. A high frequency package is provided with a metal frame disposedon a metal bottom plate and having apertures for connecting with external terminals,dielectrics being disposed on the bottom metal plate, and on which a high frequencytransmission line and a plurality of input and output terminals are formed, microwavecircuitry being contained in the metal frame, and a metal lid, wherein the frequency of theaperture's resonance arising from electromagnetic field between the metal frame andthe metal bottom plate, is shifted outside the frequency bandwidth by diminishing andoptimizing the width of the aperture.
申请人：Hideki Asao,Hiroshi Osakada,Hideyuki Oohashi,Kyouko Shinozaki,Kenji Tatano
地址：Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP,Tokyo JP
国籍：JP,JP,JP,JP,JP
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